![]() Underfill materials are a type of glue that keeps the silicon die firmly attached to the packaging material, which is where the connection to the actual pins takes place. The reason for the high failure rate was because of improper selection of the underfill material for the chip. NVIDIA CEO Jen-Hsun Huang and CFO Marvin Burkett were involved in a lawsuit filed on 9 September 2008 alleging that their knowledge of the flaw, and their intent to hide it, resulted in NVIDIA losing 31% on the stock markets. NVIDIA states this issue should not affect many chips, whereas others assert that all of the chips in these series are potentially affected. ![]() Some chips of the GeForce 8 series (concretely those from the G84 and G86 series) may suffer from an overheating problem.
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